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ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DRAIN-SOURCE DIODE CHARACTERISTICS
I S
I SM
Maximum Continuous Source Current
Maximum Pulse Source Current (Note 2)
0.51
1.5
A
A
V SD
Drain-Source Diode Forward Voltage
V GS = 0 V, I S = 0.51 A (Note 2)
0.8
1.2
V
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θ JC is guaranteed by
design while R θ CA is determined by the user's board design.
P D ( t ) =
T J ? T A
R θ J A ( t )
=
T J ? T A
R θ J C + R θ CA ( t )
= I 2 D ( t ) × R DS ( ON )
T J
Typical R θ JA for single device operation using the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment:
a. 130 o C/W when mounted on a 0.125 in 2 pad of 2oz cpper.
b. 140 o C/W when mounted on a 0.005 in 2 pad of 2oz cpper.
c. 180 o C/W when mounted on a 0.0015 in 2 pad of 2oz cpper.
1a
1b
1c
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300μs, Duty Cycle < 2.0%.
NDC7002N.SAM
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